SAC405 is a lead-free solder alloy composed of 95.5% tin, 4% silver, and 0.5% copper. It is widely used in various soldering applications, including wave soldering, reflow soldering and ball grid array(BGA) soldering.
Features:
- Low melting point of approximately 217-219°C (423-426°F)
- Reliable joints with high termal cycling resistance.
- Excellent Wetting Properties, ideal for fine-pitch components and Ball Grid Array (BGA) soldering.
- The higher silver content improves resistance to oxidation and environmental degradation.
-
SAC405 Solid 3/32" x 1/2 lb spool$58.00Low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 3/32" (2.4 mm) diameter x 1/2 lb spool.
VIEW PRODUCT -
SAC405 Solid 1/16" x 1/2 lb spool$58.00Low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/16" (1.6 mm) diameter x 1/2 lb spool.
VIEW PRODUCT -
SAC405 Solid 1/32" x 1/2 lb spool$71.00Low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/32" (0.8 mm) diameter x 1/2 lb spool.
VIEW PRODUCT -
SAC405 - 1 lb. Regular Bar$79.00Low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Nominal 1 lb. Regular Bar
VIEW PRODUCT -
SAC405 Solid 3/32" x 1 lb spool$91.00Low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 3/32" (2.4 mm) diameter x 1 lb spool.
VIEW PRODUCT -
SAC405 Solid 1/16" x 1 lb spool$91.00Low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/16" (1.6 mm) diameter x 1 lb spool.
VIEW PRODUCT -
SAC405 Solid 1/32" x 1 lb spool$104.00Low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/32" (0.8 mm) diameter x 1 lb spool.
VIEW PRODUCT -
SAC405 - 5 lb. Notch Bar$380.00Low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Nominal 5 lb. Notch Bar
VIEW PRODUCT
SAC405 Technical Data:
| Composition | 95.5% Sn, 4.0% Ag, 0.5% Cu |
| Melting Range | 217-219°C (423-426°F) |
| Density | ~7.37 g/cm³ |
| Thermal Expansion Coefficient | ~22.5 × 10⁻⁶ /°C |
| Thermal Conductivity | ~32 W/m·K |
| Specific Heat Capacity | ~0.21 J/g·K |
| Hardness (HV) | ~15-20 HV |
| Tensile Strength | 7,540 PSI |
| Applications | Aerospace, Medical, SMT, BGA |
| Advantages | High reliability, good wetting, low oxidation |
| RoHS Compliance | Yes |
| Environmental Impact | Lead-free, eco-friendly |
| Availability | Widely available in solder wire and bar forms |
| Recommended Solder Pot Temp | ~260-280°C (500-536°F) |