SAC387 consists of 95.50% tin, 3.80% silver, and 0.70% copper and is commonly used in electronic assembly applications. This particular alloy is known for its excellent solder joint reliability, low melting point (219-225°C), and broad flux compadability.
Features:
- Excellent Solder Joint Reliability - Strong mechanical properties ensure durable, long-lasting connections.
- Good Thermal Fatigue Resistance – Performs well under repeated heating and cooling cycles, reducing joint failure risks.
- Smooth Wetting & Flow Properties – Provides consistent and high-quality soldering results with good adhesion.
- Versatile Applications – Used in various industries, including consumer electronics, automotive, aerospace, and medical devices.
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SAC387 Solid 1/16" x 1/2 lb spool$54.50Low temp NSF compliant (426°F / 219°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/16" (1.6 mm) diameter x 1/2 lb spool.
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SAC387 Solid 1/32" x 1 lb spool$89.50Low temp NSF compliant (426°F / 219°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/32" (0.8 mm) diameter x 1 lb spool.
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SAC387 Solid 1/32" x 1/2 lb spool$64.50Low temp NSF compliant (426°F / 219°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/32" (0.8 mm) diameter x 1/2 lb spool.
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SAC387 Solid 3/32" x 1 lb spool$79.50Low temp NSF compliant (426°F / 219°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 3/32" (2.4 mm) diameter x 1 lb spool.
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SAC387 Solid 3/32" x 1/2 lb spool$54.50Low temp NSF compliant (426°F / 219°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 3/32" (2.4 mm) diameter x 1/2 lb spool.
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SAC387 Solid 1/16" x 1 lb spool$79.50Low temp NSF compliant (426°F / 219°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/16" (1.6 mm) diameter x 1 lb spool.
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SAC387 - 1lb. Regular Bar$64.50Low temp NSF compliant (426°F / 219°C) Copper- Silver solder for Copper, Brass and Stainless - Nominal 1 lb. Regular Bar
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SAC387 - 5lb. Notch Bar$307.50Low temp NSF compliant (426°F / 219°C) Copper- Silver solder for Copper, Brass and Stainless - Nominal 5 lb. Notch Bar
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SAC387 Technical Data:
| Characteristic | Value |
|---|---|
| Composition | 95.50% Tin (Sn), 3.80% Silver (Ag), 0.70% Copper (Cu) |
| Melting Range | 219-225°C (426-437°F) |
| Density | 7.40 g/cm³ |
| Thermal Expansion Coefficient | 21.5 μm/m°C |
| Tensile Strength | 7,510 PSI |
| Applications | Used in electronic assembly, wave soldering, selective soldering, and industrial electronics |
| Advantages | Excellent solder joint reliability, good wetting properties, lead-free compliance |
| RoHS Compliance | Yes, lead-free |
| Environmental Impact | Lead-free, reduced toxicity compared to leaded solders |
| Availability | Available in bar and wire form |
| Recommended Solder Pot Temperature | 260-320°C (500-608°F) |
SAC387 Technical Data Sheet