SAC305 is a lead-free solder alloy composed of 96.5% tin, 3% silver, and 0.5% copper. It is widely used in various soldering applications, including hand soldering, wave soldering, and surface mount technology (SMT).
Features:
- Low melting melting range of approximately 217–219°C (423–426°F).
- Provides strong and reliable solder joints, making it suitable for electronic assemblies.
- Complies with RoHS and other lead-free standards, making it environmentally friendly.
- Its manufacturing process minimizes suspended oxides, reducing dross generation during soldering.
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SAC305 Solid 1/16" x 1/2 lb spool$44.50High strength low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/16" (1.6 mm) diameter x 1/2 lb spool.
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SAC305 Solid 3/32" x 1/2 lb spool$44.50High strength low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 3/32" (2.4 mm) diameter x 1/2 lb spool.
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SAC305 Solid 1/32" x 1 lb spool$79.50High strength low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/32" (0.8mm) diameter x 1 lb spool.
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SAC305 Solid 1/32" x 1/2 lb spool$54.50High strength low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/32" (0.8mm) diameter x 1/2 lb spool.
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SAC305 Solid 3/32" x 1 lb spool$69.50High strength low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 3/32" (2.4 mm) diameter x 1 lb spool.
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SAC305 Solid 1/16" x 1 lb spool$69.50High strength low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - Solid 1/16" (1.6 mm) diameter x 1 lb spool.
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SAC305 - 1lb. Regular Bar$54.50High strength low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - 1 lb. Regular bar
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SAC305 - 5lb. Notch Bar$260.00High strength low temp NSF compliant (423°F / 217°C) Copper- Silver solder for Copper, Brass and Stainless - 5 lb. Notch bar
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SAC305 Technical Data
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Composition |
Tin (96.5%), Silver (3%), Copper (0.5%) |
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Melting Range |
Solidus: 217°C (423°F), Liquidus: 220°C (428°F) |
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Density |
7.37 g/cm³ |
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Thermal Expansion Coefficient |
21.9 µm/m/°C (20°C to 100°C) |
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Thermal Conductivity |
58.7 W/(m·K) |
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Specific Heat Capacity |
0.232 J/g·K |
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Hardness |
14.1 HV |
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Tensile Strength |
42 MPa |
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Applications |
Wave soldering, selective soldering, SMT reflow processes |
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Advantages |
- Excellent wetting speed |
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- Reduced dross generation |
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- Superior solder joint reliability |
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- Strong mechanical properties |
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Flux Compatibility |
Compatible with no-clean and water-soluble fluxes |
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RoHS Compliance |
Meets the European Union's RoHS directive for lead-free soldering |
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Safety Notes |
- Requires proper ventilation |
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- Use protective gear when working with this material |
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Environmental Impact |
Lead-free composition reduces environmental hazards |
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Availability |
Available in solder wire and solder bar |
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Recommended Solder Pot Temperature |
255–265°C for wave soldering, 280–320°C for selective soldering |
SAC305 Technical Data Sheet