SAC405 solid solder in 3/32" (2.4mm) diameter comes on a 1 lb spool, made from 95.5% tin, 4% silver, and 0.4% copper. It's lead-free, cadmium-free, and NSF compliant for potable water applications, melting at 423°F / 217°C. It forms strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi and good resistance to vibration and stress. Suitable for reflow, wave, hand soldering, and BGA applications in electronics manufacturing.
PRODUCT DETAILS & APPLICATIONS
SAC405 solid solder in 3/32" (2.4mm) diameter comes on a 1 lb spool, made from 95.5% tin, 4% silver, and 0.4% copper. It's lead-free, cadmium-free, and NSF compliant for potable water applications, melting at 423°F / 217°C. It forms strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi and good resistance to vibration and stress. Suitable for reflow, wave, hand soldering, and BGA applications in electronics manufacturing.
Used in the electronics industry through the following techniques:
- Reflow Soldering – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.
- Wave Soldering – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.
- Hand Soldering – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.
- Ball Grid Array (BGA) Soldering – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.


