SAC405 Solid 3/32" x 1/2 lb spool

Kapp Alloy's SAC405 solid solder comes in a 3/32" (2.4mm) diameter, 1/2 lb spool with a 95.5% Sn/ 4% Ag/ 0.4% Cu composition. It's NSF compliant, lead-free, and cadmium-free, making it safe for potable water applications. With a low melt point of 423°F / 217°C, it creates strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi. It's also widely used in electronics for reflow, wave, hand, and BGA soldering applications.

Used in the electronics industry through the following techniques:

• Reflow Soldering – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.
• Wave Soldering – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.
• Hand Soldering – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.
• Ball Grid Array (BGA) Soldering – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.