SAC405 solder in a 1/32" (0.8mm) solid wire, 1 lb spool is a lead-free, cadmium-free alloy made from 95.5% tin, 4% silver, and 0.4% copper. NSF compliant and potable water safe, it melts at 423°F / 217°C, making it a practical choice for copper, brass, and stainless steel applications. It delivers tensile strengths up to 7,540 psi with strong resistance to vibration and stress. Commonly used in reflow, wave, hand, and BGA soldering across electronics manufacturing and repair.
PRODUCT DETAILS & APPLICATIONS
SAC405 solder in a 1/32" (0.8mm) solid wire, 1 lb spool is a lead-free, cadmium-free alloy made from 95.5% tin, 4% silver, and 0.4% copper. NSF compliant and potable water safe, it melts at 423°F / 217°C, making it a practical choice for copper, brass, and stainless steel applications. It delivers tensile strengths up to 7,540 psi with strong resistance to vibration and stress. Commonly used in reflow, wave, hand, and BGA soldering across electronics manufacturing and repair.
Used in the electronics industry through the following techniques:
- Reflow Soldering – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.
- Wave Soldering – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.
- Hand Soldering – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.
- Ball Grid Array (BGA) Soldering – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.


