SAC405 Solid 1/16" x 1 lb spool

95.5% Sn/ 4% Ag/ 0.4% Cu

Low temperature NSF compliant Lead-free Cadmium-Free Potable water safe solder. Melts at just 423°F / 217°C for strong & ductile joints on Copper and Stainless Steel, with high tolerance to vibration and stress, and tensile strengths to 7,540 psi. Solid 1/16" (1.6mm) diameter x 1 lb spool.

Used in the elctronics industry through the following techniques:

• Reflow Soldering – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.
• Wave Soldering – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.
• Hand Soldering – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.
• Ball Grid Array (BGA) Soldering – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.