SAC405 solder in a nominal 1 lb regular bar format, made with 95.5% tin, 4% silver, and 0.4% copper. This lead-free, cadmium-free alloy melts at 423°F (217°C) and meets NSF compliance for potable water applications. It forms strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi and solid resistance to vibration and stress. Also widely used in electronics for reflow soldering, wave soldering, and BGA applications.
PRODUCT DETAILS & APPLICATIONS
SAC405 solder in a nominal 1 lb regular bar format, made with 95.5% tin, 4% silver, and 0.4% copper. This lead-free, cadmium-free alloy melts at 423°F (217°C) and meets NSF compliance for potable water applications. It forms strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi and solid resistance to vibration and stress. Also widely used in electronics for reflow soldering, wave soldering, and BGA applications.
Used in the elctronics industry through the following techniques:
- Reflow Soldering – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.
- Wave Soldering – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.
- Ball Grid Array (BGA) Soldering – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.




