SAC387 Solid 3/32" x 1/2 lb spool

95.5% Sn/ 3.8% Ag/ 0.7% Cu

Low temperature NSF compliant Lead-free Cadmium-Free Potable water safe solder. Melts at just 426°F / 219°C for strong & ductile joints on Copper and Stainless Steel, with high tolerance to vibration and stress, and tensile strengths to 7,511 psi. Solid 3/32"" (2.4mm) diameter x 1/2 lb spool.

Used in the elctronics industry through the following techniques:

Wave Soldering: SAC387 is suitable for lead-free wave soldering processes, offering excellent solderability and reduced defects like bridging.

Selective Soldering: It performs well in selective soldering applications, especially in environments with controlled oxygen levels.

Surface-Mount Technology (SMT): SAC387 is used for soldering components in SMT processes where high reliability and corrosion resistance are required.

High-Performance Electronics: Its enhanced electrical conductivity and mechanical strength make it ideal for applications demanding robust and reliable solder joints.