SAC387 Solid 3/32" x 1/2 lb spool

Kapp Alloy's SAC387 solid solder wire comes in a 3/32" (2.4mm) diameter, 1/2 lb spool with a 95.5% Sn/ 3.8% Ag/ 0.7% Cu alloy composition. NSF compliant and lead-free, it melts at just 426°F / 219°C, making it a reliable choice for potable water systems using copper, brass, or stainless steel. It delivers tensile strengths up to 7,511 psi with strong vibration and stress tolerance. Also widely used in electronics for wave soldering, selective soldering, SMT, and high-performance applications requiring consistent, corrosion-resistant joints.

Used in the electronics industry through the following techniques:

Wave Soldering: SAC387 is suitable for lead-free wave soldering processes, offering excellent solderability and reduced defects like bridging.

Selective Soldering: It performs well in selective soldering applications, especially in environments with controlled oxygen levels.

Surface-Mount Technology (SMT): SAC387 is used for soldering components in SMT processes where high reliability and corrosion resistance are required.

High-Performance Electronics: Its enhanced electrical conductivity and mechanical strength make it ideal for applications demanding robust and reliable solder joints.