SAC387 Solid 1/32" x 1 lb spool

SAC387 solid solder wire in 1/32" (0.8mm) diameter comes on a convenient 1 lb spool, made with a 95.5% Sn/ 3.8% Ag/ 0.7% Cu alloy composition. It's NSF compliant, lead-free, and cadmium-free, making it potable water safe. With a low melt point of 426°F / 219°C, it forms strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,511 psi. Also widely used in wave soldering, selective soldering, and SMT electronics applications.

Used in the electronics industry through the following techniques:

Wave Soldering: SAC387 is suitable for lead-free wave soldering processes, offering excellent solderability and reduced defects like bridging.

Selective Soldering: It performs well in selective soldering applications, especially in environments with controlled oxygen levels.

Surface-Mount Technology (SMT): SAC387 is used for soldering components in SMT processes where high reliability and corrosion resistance are required.

High-Performance Electronics: Its enhanced electrical conductivity and mechanical strength make it ideal for applications demanding robust and reliable solder joints.