Kapp Alloy's SAC387 solder is a lead-free, cadmium-free alloy made up of 95.5% Sn, 3.8% Ag, and 0.7% Cu. NSF compliant and potable water safe, it melts at just 426°F / 219°C, making it a practical choice for copper, brass, and stainless steel applications. It delivers strong, ductile joints with tensile strengths up to 7,511 psi and solid resistance to vibration and stress. Also widely used in electronics for wave soldering and high-performance applications requiring reliable, low-defect joints.
PRODUCT DETAILS & APPLICATIONS
Kapp Alloy's SAC387 solder is a lead-free, cadmium-free alloy made up of 95.5% Sn, 3.8% Ag, and 0.7% Cu. NSF compliant and potable water safe, it melts at just 426°F / 219°C, making it a practical choice for copper, brass, and stainless steel applications. It delivers strong, ductile joints with tensile strengths up to 7,511 psi and solid resistance to vibration and stress. Also widely used in electronics for wave soldering and high-performance applications requiring reliable, low-defect joints.
Used in the elctronics industry through the following techniques:
Wave Soldering: SAC387 is suitable for lead-free wave soldering processes, offering excellent solderability and reduced defects like bridging.
High-Performance Electronics: Its enhanced electrical conductivity and mechanical strength make it ideal for applications demanding robust and reliable solder joints.




