Kapp Copper-Bond Flux™
Kapp Copper-Bond flux has been designed for high temperature
soldering of all common metals except aluminum. Copper-Bond flux is an
activated liquid flux containing a mixture of inorganic salts in water,
with approximately 50% active ingredients..
Benefits and Uses
Excellent for use with 95% Cadmium- 5% Silver (Kapp Tec), 95% Tin - 5%
Silver, 94% Tin - 6% Silver, 93% Tin - 7% Silver and most solders with
temperature requirements above 550°F applied to dissimilar metals other
than aluminum. Good wetting properties.
Effective soldering range - 550°F - 800°F.
Residue is corrosive, easily removed with warm water.
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Physical Properties &
Technical Data |
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Fluxing Range |
550°F TO 800°F |
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Specific Gravity |
1.532 @ 78°F |
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Appearance |
Reddish clear liquid, no
characteristic odor |
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Solubility |
Soluble
in water |
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pH |
Slightly
Alkaline |
|
Corrosivity |
mildly
corrosive to steel and soldered joints |
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Weight Per Gallon |
12.7 |
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Shelf Life |
1 Year
unopened at ambient temp |
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Packaging |
Convenient 2 oz. and 6 oz. dispenser bottles,& 1/2 gallon & 1 gallon
bulk bottles |
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*Please Note: Flux is rated by
D.O.T. As Corrosive Hazard -
Can Not Be Shipped By Air |
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